Temperature To Reflow Solder Oven
PRO 1600 is a full forced air / nitrogen convection reflow oven with only a 31' x 31' footprint of floor space. It has been designed for reflow soldering of even the most challenging applications including metal core, high thermal mass, and ceramic assemblies.
Diy Solder Reflow Oven
PRO 1600 is very flexible in terms of profile development and optimization. Sealed heating chamber enables air ramp up rates of up to 4° Celsius/second from ambient and programming of up to 10 profile zones. It offers a unique On-The-Fly settings adjustment capability that allows creating and optimizing profiles all in a single pass. Where other batch and conveyor ovens fail to meet the desired profile curve, PRO 1600 excels.Precise software control delivers unsurpassed temperature uniformity. Maintaining a low delta T across all of the components on the assembly ensures that they are not overheated or thermally stressed. Even for prototypes, this often means avoiding to spend hours of testing and debugging failed boards.
With the optional External Thermocouple Control (ETC), profiles may be processed based on temperature readings of the assembly, not the air temperature around it. An optional allows taking high magnification images and recording video during a soldering cycle. Increased productivity, superior performance and ease of operation make the PRO 1600 a versatile system ideal for small to medium run production, prototyping, NPI, testing or curing.Financing Available. Once the Power-Key switch is turned to the On position, top cover automatically opens while the loading tray slides out.
Parts are loaded onto a mesh tray and the profile is selected with a few mouse clicks.After the Start icon is activated, the tray automatically slides into the heating chamber at an adjustable and controlled speed. A profile is then executed as per the pre-programmed parameters. Software constantly monitors actual ramp up rates and temperature inside an oven to the programmed values for accuracy. At the completion of a reflow cycle, the tray automatically exits from a heating chamber.
PRO 1600 is now in a standby mode, ready for a new cycle run. Profiles are developed, stored, and recalled within PRO 1600’s software package. It controls the reflow cycle, automation of process sequences, and automatic execution of safety checks before and during every profile run. Real-Time process graphing. Profile processing based on part / PCB temperature control.
Profile development with up to 7 thermocouples. Library with predefined profiles. On-The-Fly settings adjustment.
Temperature To Reflow Solder Oven For Beginners
Real- time data recording for documentation and analysis. Password Protected Access. User friendly environment. Designed for Windows® 7 / 10 Pro OS.Optional.